Soldering is a metallurgical process performed at low temperatures in which the solder material has a melting point that is much lower than the surfaces to be joined, referred to as substrates. Due to its lower melting point, the solder can be melted and brought into contact with the substrates with no danger of melting them. The soldering process consists of wetting the substrates surfaces with molten solder which then returns to a solid state, creating a metallurgical bond between the two surfaces.
The most common application for this process is in the assembly of electronic components onto printed circuits in order to create connections between conducting wires and other types of contacts.
