Lead free solder paste has its origin in the legal obligation to limit the use of dangerous materials in electric and electronic equipment imposed by the European
Union's RoHS directive of July 1, 2006. Among those materials are lead, mercury, cadmium, and hexavalent chromium, common substances in the soldering process.After several years of investigation, it was decided that the best option is a solder with the SnAg3.8Cu0.7(SAC) active principal, whcih is lead free and provides a higher quality solder without putting the technicians that handle it directly at risk.
This type of solder requires 3 seconds of contact at a temperature of 260º to achieve a good level of quality.
