Circuit encapsulation is the design and implementation of structures meant for the protection of integrated circuits. In this phase the integrated circuit is covered with protective layer of plastic, resine or a ceramic casing in order to avoid physical damage or corrosion.
The encapsulation solutions currently being used are made of polyurethane, developed for mass production of electronic models in which polyurethane, besides the user and the encapsulated component, also serves as a shell. For many years, polyurethane based resines have been used successfully in the electric and electronic component industry. The encapsulation, fixation and integration of electric components with bubbless compact polyurethane systems has become an important field of application. Traditional encapsulation resines, with their long fabrication cycles have already reached their limits in terms of productivity for modern products. In order to respond to the resulting requirements it was necessary to develop new production processes and the resulting products. The results achieved are characterised by very short reaction times. These polyurethane systems allow one to work with RIM technology and, thusly, take advantage of its benefits.
